Guangdong KDD Functional Materials Co., Ltd.
Tempering Sintering Functional ink
Release time：2025-10-28
1. Pain points in industry applications
Traditional annealing sintering resin has high sintering temperature (≥ 800 ℃), high energy consumption, and low production efficiency;
After sintering, there are many residual impurities that affect the properties and appearance of the substrate (such as metals and ceramics);
During the sintering process, the bonding force between the resin and the substrate is weak, which can easily lead to peeling and delamination problems.
2. Customized solutions
Low temperature sintering technology: Optimize resin formula, reduce sintering temperature to 500-700 ℃, reduce energy consumption by 30% -40%, and shorten sintering time (from 2 hours to within 1 hour);
Low residue formula design: Using high-purity monomer raw materials, the residual amount after sintering is ≤ 0.5% to avoid impurities affecting the performance of the substrate;
Interface bonding enhancement: Adding specialized coupling agents to improve the interface bonding strength between resin and metal/ceramic substrates, with an adhesion level of 0 after sintering.
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Since 2011, We Focusing on Personalized Functional Resins
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Add: No. 28, Weihai Zhigu Data Center, Shaping, Heshan City, Guangdong Province, China
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