Guangdong KDD Functional Materials Co., Ltd.
Farewell to Ethyl Cellulose! A New Engine for Glass/Ceramic Conductive Paste — A7011 Functional Resin: A New Solution for Low-Temperature, Low-Odor and High-Cleanliness Sintered Conductive Paste
Release time:2026-06-10
With the iterative upgrading of the electronic paste industry, silver-coated copper paste is gradually replacing the traditional pure silver system, and the industrial sintering process has also undergone simultaneous innovation: the sintering temperature has dropped from the previous above 800℃ to 400℃~500℃, and nitrogen atmosphere protective sintering is mostly adopted. Traditional ethyl cellulose cannot be completely carbonized in such a low-temperature and inert gas environment, prone to carbon residue, resulting in poor contact of conductive layers, appearance defects and other problems. The industry is in urgent need of alternative resin carrier solutions adapted to the new process.
I. Application Scenarios
Applicable Products: Ceramic sintered conductive pastes (silver-coated copper paste, silver paste and other systems)
Applicable Working Conditions: Preparation of conductive/decorative inks, screen printing construction, and paste storage for ceramic electronic components requiring low-temperature sintering in nitrogen atmosphere
Core Demands and Pain Points:
1. Traditional ethyl cellulose cannot be completely carbonized in a nitrogen atmosphere at 400-500℃, and residual carbon affects conductive performance and appearance;
2. Traditional systems have strong odor, poor construction environment and high pressure of environmental compliance;
3. Silver-coated copper/silver powder pastes are prone to agglomeration and sedimentation during storage, and even gelation and scrapping in severe cases, with poor stability affecting the consistency of conductive performance;
4. Prone to screen clogging, resulting in poor continuity of screen printing construction and low yield;
5. High sintering residue with visible traces and insufficient carbonization cleanliness, affecting substrate adhesion and conductive layer performance.
II. Core Technical Solution
1. Applicable Substrates: Glass, metal, ceramics (home appliance glass, ceramic electronic components, etc.)
2. Coating Resin System: A7011 alcohol ether solvent-based functional resin with a solid content of 45% and low acid value (<1mgKOH/g), specially designed for low-temperature sintering processes
3. Sintering Conditions: Complete sintering at a minimum of 350℃, compatible with 400℃~500℃ nitrogen atmosphere sintering process with no residue and no traces
4. Key Performances:
· Storage Stability of Gold/Silver Powder & Silver-Coated Copper Powder: Excellent storage compatibility with metal powders, effectively preventing agglomeration and sedimentation of silver powder/silver-coated copper powder and extending the service life of paste
· Adhesion: Strong adaptability to glass and ceramic substrates; no residue or traces after sintering, providing a stable adhesion foundation for conductive layers
· Constructability: Resistant to screen clogging, compatible with screen printing process, low odor, improving construction environment and production continuity
· Carbonization Cleanliness: Fully decomposable in a nitrogen atmosphere at 400℃~500℃ with no residue or traces after baking; excellent carbonization cleanliness that does not affect the conductive performance and appearance consistency of conductive layers

III. Solution Comparison
Comparison Dimension | Traditional Ethyl Cellulose Solution | A7011 Functional Resin Solution | Core Advantages |
Sintering Temperature & Atmosphere Adaptability | Requires air sintering above 700℃; prone to residue in 400-500℃ nitrogen atmosphere | Sinterable at a minimum of 400℃, compatible with low-temperature nitrogen atmosphere processes | Perfectly adapts to the new process of silver-coated copper paste and avoids carbon residue problems |
Adhesion | Residual carbon easily causes poor interlayer bonding | No residue or traces after sintering, compatible with glass/ceramic substrates | Ensures stable bonding between conductive layer and substrate, improving finished product reliability |
Storage Stability | Silver-coated copper/silver powder is prone to agglomeration and sedimentation with short paste service life | Excellent storage stability with metal powders and resistance to agglomeration | Reduces paste waste and batch defect rate |
Substrate Adaptability | Poor wettability of partial systems on glass/ceramic | Excellent dispersion, wetting and encapsulation properties for inorganic pigments and substrates | Compatible with mainstream substrates such as home appliance glass and ceramics for wider application scenarios |
Construction Experience | Strong odor, easy screen clogging and poor production environment | Low odor, screen clogging resistance and smooth screen printing | Improves workshop environmental protection, construction efficiency and product yield |
Carbonization Cleanliness | Prone to carbon residue in low-temperature nitrogen atmosphere, affecting conductive performance and appearance | Fully decomposable at 400℃+ in nitrogen atmosphere with high cleanliness | Stabilizes conductive layer performance and improves product appearance consistency |
IV. Clear Conclusions and Selection Recommendations
Conclusion: A7011 functional resin is an ideal alternative to ethyl cellulose adapted to the low-temperature nitrogen sintering process of silver-coated copper paste. It integrates the comprehensive advantages of low odor, high storage stability, easy construction and high sintering cleanliness, perfectly solves the carbon residue pain point of traditional systems in 400-500℃ nitrogen atmosphere, and adapts to the production and application needs of home appliance glass, ceramic conductive pastes and tempered inks.
Selection Recommendations:
1. Recommended as a resin carrier substitute for home appliance glass sintered tempered inks and ceramic sintered silver-coated copper/silver pastes;
2. Prioritized for mid-to-high-end product scenarios with clear requirements for odor, sintering residue and storage stability;
3. The system viscosity can be adjusted with alcohol ether solvents according to process requirements to adapt to different screen printing conditions.

V. Corporate Professional Endorsement
Our company focuses on the R&D and application of functional resins and electronic paste carrier materials, with mature supporting processes and practical application cases for home appliance glass and ceramic electronic pastes. Especially for the low-temperature nitrogen sintering process of silver-coated copper pastes, we provide customized formula development, free sample testing and batch supporting services, meeting industrial environmental protection standards and export requirements, and offering full-process technical support for customers.
VI. FAQ
1.Q: Will A7011 really produce no carbon residue when sintered at 400℃ in a nitrogen atmosphere?
A: Yes. Specially designed for low-temperature sintering processes, A7011 has a TGA decomposition temperature ranging from 200℃ to 450℃. It can be completely decomposed at 400℃, leaving no residue or traces after baking even in nitrogen protective sintering atmosphere. Its excellent carbonization cleanliness will not affect the conductive performance and appearance consistency of conductive layers.
2.Q: Can A7011 improve the storage stability of silver-coated copper paste when replacing ethyl cellulose?
A: Yes. A7011 has excellent encapsulation, dispersion and wetting capabilities for metal powders such as silver-coated copper powder and silver powder. It can effectively inhibit powder agglomeration and sedimentation, significantly improve paste storage stability, extend service life and reduce batch defects.
3.Q: Does A7011 have a strong odor during construction? Will it cause screen clogging?
A: Adopting a low-odor alcohol ether solvent system, A7011 has a much lower odor than traditional ethyl cellulose systems, which can significantly improve the construction environment. Meanwhile, it resists screen clogging, adapts to conventional screen printing processes, and improves production continuity and product yield.
For complete technical parameters, sample tests and customized formula solutions, please contact our customer managers for one-on-one technical support and supporting services.
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